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6'' Silicon Carbide Wafer

  • Characterisyics

    Silicon Carbide Substrate As the 3rd generation semiconductor,Silicon carbide possesses wide band-gap,excellent thermal conductivity, high breakdown field strength,saturated electron drift velocity,mechanical hardness and anti-radiation,which are superior to that of conventional semiconductor materials including silicon (Si) and gallium arsenide (GaAs) greatly.Unique properties have hastened SiC to find applications in fabricating high temperature,high frequency, high power and high radiation,and optoelectronic devices during recent years.Besides,small lattice and thermal expansion mismatches with III-group nitride make SiC an outstanding substrate material for the epitaxial growth of nitride films. 

  • Application

    Power electronic devices:Schottky diodes,MOSFET,JFET,BJT,PiN diodes,IGBT etc.
    Optoelectronic devices:GaN/SiC LED.

Description
Characterisyics
Material : High Purity Single Crystal Silicon Carbide,Production grade
Polytype : Single-Crystal 4H
Orientation : <0001> Off-axis 4 +/-0.5 deg toward <11-20>
Primary Flat : <11-20> +/-5 deg
Primary Flat length : 47.5 or 57.5 +/- 1.5 mm
Diameter : 150.0 +/- 0.25 mm
Thickness: 350 +/- 25 um
TTV : </= 15 um
WARP : </= 60 um
Si-face Surface & Roughness : CMP Epi-ready polish,Ra<0.5nm
Dopant : Nitrogen (N-Doped)
Conduction Type : N-type
Resistivity : 0.015 ~ 0.028 Ohm.cm
Micropipe Density : </= 1 micropipes/cm2
Total usable area : >/=90%
Edge Exclusion : </= 3mm
Laser Marking : Back Side @ C-face
Package : Multi wafer box unless otherwise specified